AI Technology

AI Technology

AI Technology, Inc. is a manufacturer of adhesives, thermal management material, and advanced materials for multiple electronic industries. Products include: dicing tapes, dicing die-attach adhesive films, conformal coatings, UV-block coatings, encapsulants, sealants, thermal gels, thermal greases, RF/EMI shielding solutions, gap-filling pads, compressible phase-change pads, stress-free and thermally conductive epoxy pastes and films in conductive or dielectric variations.




AI Technology Product Brochure

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  1. AI Technology COOL-GREASE CGR8010-XT Electrically Conductive 3 cc Syringe

    AI Technology COOL-GREASE CGR8010-XT Electrically Conductive 3 cc Syringe

      

    Sold as a pack (10/pk). AI Technology CGR8010-XT is a silver filled, ultra-high thermally conductive cool grease paste. The non-curing nature of this electro-conductive thermal grease makes it fitting as an interfacial compound for extreme thermal and electrical transfer for power devices. With a non-silicone base for long-term non-drying applications. CGR8010-XT is available in syringes for automatic needle dispensing applications or in jars. 3 cc Syringe. Learn More
  2. AI Technology PRIMA-BOND EG7655 Epoxy Paste Adhesive 2 oz Kit

    AI Technology PRIMA-BOND EG7655 Epoxy Paste Adhesive 2 oz Kit

      

    Sold as a pack (12 kits/pk). AI Technology EG7655 is an alumina filled, reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG7655's high thermal conductivity and flexibility make it ideal for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80 to 100 ºC for simple rework. Once cured the adhesive is flexible with 80 A hardness and tensile elongation of more than 30%. EG7655 is available in syringes for automatic needle dispensing applications or in jars. Upon request, the adhesive can be shipped premixed and frozen. 2 oz Kit. Learn More
  3. AI Technology PRIMA-BOND ME7155-3 Epoxy Paste Adhesive 10 cc EFD Syringe

    AI Technology PRIMA-BOND ME7155-3 Epoxy Paste Adhesive 10 cc EFD Syringe

      

    Sold as a pack (18/pk). AI Technology ME7155-3 is a slightly lower bond strength but more flexible version of ME7155. The ME7155-3 exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it favorable for bonding high-powered, large area die and components. It can be easily reworked at 80 to 100 ºC and is available in syringes for automatic needle dispensing applications or in jars. 10 cc EFD Syringe. Learn More
  4. AI Technology PRIMA-SOLDER EG8050-E Epoxy Paste Adhesive 3 cc EFD Syringe

    AI Technology PRIMA-SOLDER EG8050-E Epoxy Paste Adhesive 3 cc EFD Syringe

      

    Sold as a pack (14/pk). AI Technology EG8050-E is an electrically conductive, silver filled epoxy paste adhesive. It exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG8050-E can be readily reworked at 80 to 100 ºC and is fitting for applications such as large area die attach and substrate attach because of its capability to bond materials with highly mismatched CTE's. Both viscosity and thixotropic index can be modified to your specific needs. EG8050-E is available in syringes for automatic needle dispensing applications or in jars. EG8050-E can be premixed and frozen. Premixed 3 cc EFD Syringe. Learn More
  5. AI Technology PRIMA-SOLDER ME8452-A Epoxy Paste Adhesive 1 cc TSI Syringe

    AI Technology PRIMA-SOLDER ME8452-A Epoxy Paste Adhesive 1 cc TSI Syringe

      

    Sold as a pack (17/pk). AI Technology ME8452-A is an accelerated version of ME8452 for snapcuring applications. This innovative silver-filled epoxy paste adhesive is solvent free, reworkable, and electrically and thermally conductive. With outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). ME8452-A can be easily reworked from 80 to 100 ºC and is fitting for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Both viscosity and thixotropic index can be modified to your exact needs. ME8452-A is available in syringes for automatic needle dispensing applications or in jars. 1 cc TSI Syringe. Learn More

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