Encapsulants

Ellsworth is the largest global distributor of Encapsulants and Potting Systems. We represent nearly every major manufacturer and supply products of all chemical types. Some two-part systems pair specific resins and catalysts. Be sure to consult product technical data sheets for more information.

Items 1 to 10 of 471 total

per page
Page:
  1. 1
  2. 2
  3. 3
  4. 4
  5. 5

Set Descending Direction
  1. 3M Scotch-Weld DP270 Epoxy Potting Compound Black 1.7 oz Duo-Pak Cartridge

    3M Scotch-Weld DP270 Epoxy Potting Compound Black 1.7 oz Duo-Pak Cartridge

      

    3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and resistance to thermal shock. 1.7 oz Duo-Pak Cartridge. Learn More
  2. 3M Scotch-Weld DP270 Epoxy Potting Compound Clear 1.7 oz Duo-Pak Cartridge

    3M Scotch-Weld DP270 Epoxy Potting Compound Clear 1.7 oz Duo-Pak Cartridge

      

    3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and resistance to thermal shock. 1.7 oz Duo-Pak Cartridge. Learn More
  3. Cytec CONACURE EA-028 Epoxy Encapsulant Catalyst 1 gal Can

    Cytec CONACURE EA-028 Epoxy Encapsulant Catalyst 1 gal Can

      

    Cytec CONACURE EA-028 Curative Clear Amber cures at room temperature, has a 30 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and thermal shock resistance. 1 gal Can. Learn More
  4. Cytec CONACURE EA-028 Epoxy Encapsulant Catalyst 5 gal Pail

    Cytec CONACURE EA-028 Epoxy Encapsulant Catalyst 5 gal Pail

      

    Cytec CONACURE EA-028 Curative Clear Amber cures at room temperature, has a 30 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and thermal shock resistance. 5 gal Pail. Learn More
  5. Cytec CONACURE EA-87 Epoxy Encapsulant Catalyst 1 gal Can

    Cytec CONACURE EA-87 Epoxy Encapsulant Catalyst 1 gal Can

      

    Cytec CONACURE EA-87 Curative Light Amber is heating curing, has a 90 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and is more cost efficient than EA-87. 1 gal Can. Learn More
  6. Cytec CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal Pail

    Cytec CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal Pail

      

    Cytec CONACURE EA-87 Curative Light Amber is heating curing, has a 90 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and is more cost efficient than EA-87. 5 gal Pail. Learn More
  7. Cytec CONAP EN-5852 Polyurethane Encapsulant Black 1 gal Kit

    Cytec CONAP EN-5852 Polyurethane Encapsulant Black 1 gal Kit

      

    Cytec CONAP EN-5852 Polyurethane Resin System Black is a two component encapsulating system featuring UL Relative Temperature Index (RTI) of 130 °C, a low durometer of shore A 85 hardness, and UL 94 V-0 rating at 2.8 mm thickness. The combinations of these features enable excellent flame retardancy at lower material thickness and flexibility over a wide temperature range. The end result is reduced stress and a heat resistant environment for your electronic components. The 1 gal Kit consists of Part A in a 1 qt size, and Part B in a 1 gal size. Learn More
  8. Cytec CONAPOXY AD-10 Epoxy Encapsulant Brown 1 gal Can

    Cytec CONAPOXY AD-10 Epoxy Encapsulant Brown 1 gal Can

      

    Cytec CONAPOXY AD-10 Epoxy Brown is a one component, structural adhesive that is used for bonding and sealing electronics, metals, plastics, ceramics, batteries, structural materials, and mini potting. It offers fast heat curing, good dielectric properties, thermal stability, and reduces waste. 1 gal Can. Learn More
  9. Cytec CONAPOXY AD-10 Epoxy Encapsulant Brown 1 qt Can

    Cytec CONAPOXY AD-10 Epoxy Encapsulant Brown 1 qt Can

      

    Cytec CONAPOXY AD-10 Epoxy Brown is a one component, structural adhesive that is used for bonding and sealing electronics, metals, plastics, ceramics, batteries, structural materials, and mini potting. It offers fast heat curing, good dielectric properties, thermal stability, and reduces waste. 1 qt Can. Learn More
  10. Cytec CONAPOXY AD-10 Epoxy Encapsulant Brown 5 gal Pail

    Cytec CONAPOXY AD-10 Epoxy Encapsulant Brown 5 gal Pail

      

    Cytec CONAPOXY AD-10 Epoxy Brown is a one component, structural adhesive that is used for bonding and sealing electronics, metals, plastics, ceramics, batteries, structural materials, and mini potting. It offers fast heat curing, good dielectric properties, thermal stability, and reduces waste. 5 gal Pail. Learn More

Items 1 to 10 of 471 total

per page
Page:
  1. 1
  2. 2
  3. 3
  4. 4
  5. 5

Set Descending Direction