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Part number: SEC1233 4 GRAM
Manufacturer SKU: SEC1233 4GR
Please contact your Ellsworth Customer Service Representative to confirm availability and delivery time.
ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g Packet.
| Typical Use: | Electronic applications, "cold solder." |
| Chemical Composition: | Epoxy |
| Color: | Silver |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 24 to 72h @ 25 °C; 1h @ 60 °C |
| Elongation: | 20 to 30% @ break |
| Flash Point: | Part A: >93 °C; Part B: 100 °C |
| Hardness: | 70 D |
| Mix Ratio: | 1:1 by volume; 1:1 by weight |
| Service Temperature: | -40 to 150 °C |
| Shear Strength: | 600 |
| Specific Gravity: | Part A: 3.88; Part B: 3.97 |
| Tensile Strength: | 450 psi |
| Thermal Conductivity: | 4.65 W/mK |
| Viscosity: | Mixed: 29,500 to 582,000 |
| Volume Resistivity: | 0.0016 ohm-cm |